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雙軸晶圓切割機8020系列概要TheADT8020DicingSawhastwofacingspindlesthatcansimultaneouslydicewafersathighthroughput
雙軸晶圓切割機8020系列概要 |
The ADT 8020 Dicing Saw has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8020 is a high accuracy system that can dice workpieces of up to 8-inch in diameter, at high performances and low cost of operation.
雙軸晶圓切割機8020系列特點: |
Flexibility - Supports Hub and Hubless blades up to 3" O.D. |
Spindles of 1.8 kW or 2.4 kW high power (for challenging applications) |
Superior vision system with continuous zoom magnification |
Intuitive operation interface using a large 19" touch screen monitor |
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