WireBonder概要：HighSpeedWireBonderforLEDandDiscreteDeviceswithEnhancedProductivityandWideFrameHandlingCapabilityWireBonder特點(diǎn)：Platformthatachievedhighspeedbondingof42ms/0

詳細(xì)介紹

Wire Bonder概要：

High Speed Wire Bonder for LED and Discrete Devices with Enhanced Productivity and Wide Frame Handling Capability

Wire Bonder特點(diǎn)：

Platform that achieved high speed bonding of 42ms/0.7mm (45ms/2 mm)

with completely updated X, Y and Z motors

Bonding accuracy of±3.0μm（3σ）achieved

Capable of indexing 102mm x 300mm lead frames by allowing Y bonding area of 95mm

Simultaneous detection and bonding capability in X and Y directions

Wire Bonder規(guī)格參數(shù)：

Product Name	Wire Bonder
Model	UTC-5100
Bonding Accuracy	±3.0 μm (3 σ), (The bonding accuracy changes depending on the conditions of device and temperature)
Bonding Speed	42 ms/0.7 mm wire (45 ms/2 mm wire) (with loop control and force detection mode) Using Shinkawa standard device
Bonding Wire Length	4 mm maximum (Varies depending on device conditions)
Resolution	XY table: 0.1 μm, Z-axis: 0.1 μm
Vibration Control	Shinkawa NRS - Non Reaction Servo System
Bonding Area	X: 66mm - Camera offset,　Y: 95mm - Camera offset
Wire Size	φ18–50 μm
Bonding Force	3–1,000 gf
No. of Bonding Wires	12,000 wires maximum
Loader / Unloader	Fully automatic magazine stacker system (Option: stocker system)
Workpiece Size	Width 20–102 mm
	Length 95–300 mm
	Thickness0.1 - 0.5 mm (Varies depending on type of device) (Conversion parts are required when thickness changes)
Production Management	Management of equipment availability through production management monitoring screen
Option Available	Communication interface　SECS-I/SECS-II, HSMS, GEM
Utilities	Input Power SupplySingle Phase 100VAC (±5% input variation)　50/60Hz (other voltages require transformer)
	Power ConsumptionApprox.1.2kVA (1.1kW)
	CDA500kPa (5 kgf/cm2) 102L/min
	Vacuum-74kPa (-550 mmHg) or below (gauge)
Physical Dimensions and Mass	1,222W × 964D × 2,087H mm Approx. 520kg