當(dāng)今世界越來(lái)越關(guān)注生態(tài)友好，半導(dǎo)體生產(chǎn)工藝的持續(xù)改進(jìn)則進(jìn)一步導(dǎo)致了集成電路內(nèi)部組件尺寸越來(lái)越小，也變得越來(lái)越靈敏和脆弱。由此導(dǎo)致了芯片失效分析的一個(gè)特定挑戰(zhàn)：如何將樣品封裝去除卻不會(huì)導(dǎo)致功能失效？ Nisene公司x一代的芯片開(kāi)封系統(tǒng)為半導(dǎo)體生產(chǎn)制造技術(shù)和失效分析之間的鴻溝搭建了一座橋梁：等離子芯片開(kāi)封機(jī)—PlasmaEtch Nisene科技集團(tuán)有限公司從事集成電路失效分析的自動(dòng)開(kāi)封裝置研發(fā)超

詳細(xì)介紹

當(dāng)今世界越來(lái)越關(guān)注生態(tài)友好，半導(dǎo)體生產(chǎn)工藝的持續(xù)改進(jìn)則進(jìn)一步導(dǎo)致了集成電路內(nèi)部組件尺寸越來(lái)越小，也變得越來(lái)越靈敏和脆弱。由此導(dǎo)致了芯片失效分析的一個(gè)特定挑戰(zhàn)：如何將樣品封裝去除卻不會(huì)導(dǎo)致功能失效？ Nisene公司xin一代的芯片開(kāi)封系統(tǒng)為半導(dǎo)體生產(chǎn)制造技術(shù)和失效分析之間的鴻溝搭建了一座橋梁：等離子芯片開(kāi)封機(jī)—PlasmaEtch Nisene科技集團(tuán)有限公司從事集成電路失效分析的自動(dòng)開(kāi)封裝置研發(fā)超過(guò)40年，擁有多項(xiàng)電化學(xué)及微波等離子開(kāi)封機(jī)技術(shù)的專li。

產(chǎn)品介紹

PlasmaEtch Process - 美國(guó)專li9,548,227 B2 - 使用等離子體放電管的微波誘導(dǎo)等離子體。

微波誘導(dǎo)式等離子芯片開(kāi)封系統(tǒng) ---- PlasmaEtch

無(wú)論是傳統(tǒng)的金線樣品，還是樣品都采用銅線或銀線，PlasmaEtch都能提供安全可靠的蝕刻。

As the world moves toward more eco-friendly processes and the semiconductor manufacturing industry continues to make smaller parts with sensitive internal components, failure analysts are presented with a unique challenge: how do you etch these samples? Nisene Technology Group has bridged the gap between semiconductor manufacturing technology and failure analysis with its latest decapsulation system: the PlasmaEtch.

工作原理：

The PlasmaEtch decapsulation system is a revolutionary patent-pending gas-based semiconductor etching system. Employing a never-before-seen application of microwaved gases inciting chemical radicals for isotropic etching, the PlasmaEtch is the greenest and most cost-effective etching solution available. The PlasmaEtch can etch most sample sizes, encapsulant types, and wire bond types. Whether it’s a more traditional gold wire sample, or if the sample features copper or silver wires, the PlasmaEtch delivers a safe and reliable etch.

PlasmaEtch創(chuàng)新點(diǎn)：

Afterburner Downstream Focused Plasma Etching（延時(shí)激發(fā)下行聚焦離子蝕刻）
Mass Flow Controlling for All Gases（所有氣體流量可控）
No Microwave Radiation Exposure to Samples During Etch Process（無(wú)微波輻射）
Low Temperature Etching（低溫蝕刻）
Isotropic Etching（等向性蝕刻）

Unlike typical and less sophisticated plasma decap systems that take many hours or even days to get to the surface of the die, the PlasmaEtch can clear the encapsulant of most package types and reveal the complete die surface and wire sweep in a matter of a couple hours. Chemical-free decapsulation has never been so effective.

主要特色（Highlights）：

Highly Customizable Etch Recipes（高度可定制的蝕刻配方）
Etches a Wide Variety of Package Types（可蝕刻各種各樣的封裝類型）
Completely Chemical-free Decap（*非化學(xué)方式蝕刻）
Eco-friendly（生態(tài)友好環(huán)保）
Touchscreen Interface（觸控屏）
PC/Windows-based GUI（基于PC / Windows的GUI）
The Only Solution for Silver Wires（銀線的唯1解決方案）
Etches Samples with All Wire Types（可蝕刻所有引線類型的樣品）
Small Footprint Suited for Tabletop（桌上型緊湊尺寸機(jī)柜）