Die Attach特點： |
High-accuracy bonding by unique 3D-NRS technology |
High-productivity and space-saving footprint by adopting twin-head |
High-speed thin die pick-up system with a speed of 400ms / t:20um(option) *Depending on material conditions |
Friction-free bonding head with simultaneous positional and force control for thin die stacked devices |
Cleanness control with HEPA-filter and stainless steel full cover |
Equipped with die back-side camera on each bonding head, enhancing inspection function with a total of 8 cameras |
Capable of handling large substrates up to 120mm width x 300mm length |
Die Attach規格參數： |
Product Name | Die Bonder |
Model | SPA-1000 |
Bonding Method | DAF bonding |
Accuracy | XY：±5μm (3σ)、θ：±0.05°(3σ) (Machine accuracy excluding material-induced factors) |
Productivity | The productivity increased by 2.5 times compared with conventional model. (Theoretical value with Shinkawa's standard sample) |
Chip Size | □0.8 – 25mm |
Wafer Size | Maximum 12-inch |
Substrate/Leadframe Size | Width 40 – 120mm Length 180 – 300mm Thickness0.05 – 0.8mm |
Options Available | Thin die application kit, Film attachment unit, capability to handle overhead transport (OHT) |
Utilities | Input Power Supply：Single Phase AC200V±5% 50/60Hz (Other power supply options available on request) |
| Power：Maximum 3.2 kVA (3.2kW) | |
Consumption | |
Air：500kPa (5kgf/cm2) 900 L/min | |
Vacuum：Below -74kPa (-550mmHg) (gage) | |
| Physical Dimensions and Mass | Approx. 2,280W × 1,510D × 1,670H mm Approx. 2,300 kg (excludes monitor display and signal tower) |
