Wire Bonder概要： |
High Speed Wire Bonder for LED and Discrete Devices with Enhanced Productivity and Wide Frame Handling Capability
Wire Bonder特點： |
Platform that achieved high speed bonding of 42ms/0.7mm (45ms/2 mm) with completely updated X, Y and Z motors |
Bonding accuracy of±3.0μm（3σ）achieved |
Capable of indexing 102mm x 300mm lead frames by allowing Y bonding area of 95mm |
Simultaneous detection and bonding capability in X and Y directions |
Wire Bonder規格參數： |
Product Name | Wire Bonder |
Model | UTC-5100 |
Bonding Accuracy | ±3.0 μm (3 σ), (The bonding accuracy changes depending on the conditions of device and temperature) |
Bonding Speed | 42 ms/0.7 mm wire (45 ms/2 mm wire) (with loop control and force detection mode) Using Shinkawa standard device |
Bonding Wire Length | 4 mm maximum (Varies depending on device conditions) |
Resolution | XY table: 0.1 μm, Z-axis: 0.1 μm |
Vibration Control | Shinkawa NRS - Non Reaction Servo System |
Bonding Area | X: 66mm - Camera offset, Y: 95mm - Camera offset |
Wire Size | φ18–50 μm |
Bonding Force | 3–1,000 gf |
No. of Bonding Wires | 12,000 wires maximum |
Loader / Unloader | Fully automatic magazine stacker system (Option: stocker system) |
Workpiece Size | Width 20–102 mm |
Length 95–300 mm | |
Thickness0.1 - 0.5 mm (Varies depending on type of device) (Conversion parts are required when thickness changes) | |
Production Management | Management of equipment availability through production management monitoring screen |
Option Available | Communication interface SECS-I/SECS-II, HSMS, GEM |
Utilities | Input Power SupplySingle Phase 100VAC (±5% input variation) 50/60Hz (other voltages require transformer) |
Power ConsumptionApprox.1.2kVA (1.1kW) | |
CDA500kPa (5 kgf/cm2) 102L/min | |
Vacuum-74kPa (-550 mmHg) or below (gauge) | |
| Physical Dimensions and Mass | 1,222W × 964D × 2,087H mm Approx. 520kg |
